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ISBN: 9780470065419
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2007, ISBN: 9780470065419
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2007, ISBN: 9780470065419
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2007, ISBN: 9780470065419
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ISBN: 9780470065419
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in… Altro …
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2007, ISBN: 9780470065419
The topic of thin films is an area of increasing importance inmaterials science, electrical engineering and applied solid statephysics; with both research and industrial applications inmi… Altro …
2007
ISBN: 9780470065419
eBooks, eBook Download (PDF), 1. Auflage, [PU: John Wiley & Sons], John Wiley & Sons, 2007
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Informazioni dettagliate del libro - Dielectric Films for Advanced Microelectronics
EAN (ISBN-13): 9780470065419
ISBN (ISBN-10): 0470065419
Anno di pubblicazione: 2007
Editore: Wiley
508 Pagine
Lingua: eng/Englisch
Libro nella banca dati dal 2009-11-27T12:40:01+01:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-11-06T18:24:21+01:00 (Zurich)
ISBN/EAN: 0470065419
ISBN - Stili di scrittura alternativi:
0-470-06541-9, 978-0-470-06541-9
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : martin green, marti green, green karen, john paul, martin mae, baklanov
Titolo del libro: microelectronics
Dati dell'editore
Autore: Mikhail Baklanov
Titolo: Wiley Series in Materials for Electronic & Optoelectronic Applications; Dielectric Films for Advanced Microelectronics
Editore: Wiley; John Wiley & Sons
508 Pagine
Anno di pubblicazione: 2007-04-04
Lingua: Inglese
208,99 € (DE)
EA; E107; E-Book; Nonbooks, PBS / Chemie; Technische Anwendung von Oberflächenbeschichtungen und -filmen; Dielectrics & Electric Insulators; Dielektrika u. Isolatoren; Dielektrizität; Dünne Schichten, Oberflächen u. Grenzflächen; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Materials Science; Materialwissenschaften; Mikroelektronik; Thin Films, Surfaces & Interfaces; Dielektrika u. Isolatoren; Dünne Schichten, Oberflächen u. Grenzflächen; BB
Series Preface. Preface. (Mikhail Baklanov, Martin Green and KarenMaex). 1. Low and Ultralow Dielectric Constant Films Preparedby Plasma-Enhanced Chemical Vapor Deposition. (A.Grill). 2. Spin-On Dielectric Materials. (GeraudDubois, Willi Volksen and Robert D. Miller). 3.Porosity of Low Dielectric Constant Materials. 3.1 Positron Annihilation Spectroscopy. (David W.Gidley, Hua-Gen Peng, and Richard Vallery). 3.2Structure Characterization of Nanoporous InterlevelDielectric Thin Films with X-ray and Neutron Radiation.(Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K.Lin, Wen-li Wu). 3.3 Ellipsometric Porosimetry. (M. R.Baklanov). 4.Mechanical and Transport Properties of Low-kDielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O.Rodriguez, R. Saxena, and W.N. Gill). 5. Integration of low-k dielectric films in damasceneprocesses. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M.Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F.Iacopi). 6. ONO structures and oxynitrides in modern microelectronics.Material science, characterization and application.(Yakov Roizin and Vladimir Gritsenko). High Dielectric constant Materials. 7. Material Engineering of High-k GateDielectrics. (Akira Toriumi and Koji Kita). 8. PhysicalCharacterisation of ultra-thin high-k dielectric. (T.Conard, H. Bender and W. Vandervorst). 9. Electrical Characterization of Advanced GateDielectrics. (Robin Degraeve, Jurriaan Schmitz,Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, andGuido Groeseneken). Medium dielectric constant materials. 10. Integration Issues of High-k Gate Dielectrics.(Yasuo Nara). Dielectric films for interconnects (packaging). 11. Anisotropic Conductive Film (ACF) for AdvancedMicroelectronic Interconnects. (Yi Li, C. P.Wong). Index.Altri libri che potrebbero essere simili a questo:
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9780470017944 Dielectric Films for Advanced Microelectronics (Mikhail Baklanov, Karen Maex, Martin Green)
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