2006, ISBN: 9783527326464
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Altro …
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2006, ISBN: 9783527326464
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2012, ISBN: 3527326464
Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… Altro …
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ISBN: 9783527326464
hardback, [PU: Wiley-VCH, Weinheim]
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Altro …
2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Altro …
2006
ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Altro …
2012, ISBN: 3527326464
Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… Altro …
ISBN: 9783527326464
hardback, [PU: Wiley-VCH, Weinheim]
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Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Informazioni dettagliate del libro - Handbook of Wafer Bonding
EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Copertina rigida
Anno di pubblicazione: 2012
Editore: Wiley-VCH
395 Pagine
Peso: 0,937 kg
Lingua: Englisch
Libro nella banca dati dal 2008-09-14T15:42:19+02:00 (Zurich)
Pagina di dettaglio ultima modifica in 2024-01-24T20:43:42+01:00 (Zurich)
ISBN/EAN: 3527326464
ISBN - Stili di scrittura alternativi:
3-527-32646-4, 978-3-527-32646-4
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : ramm, peter james, peter troy, jia, jian, wiley vch verlag gmbh
Titolo del libro: bon, bonding, bond, handbook
Dati dell'editore
Autore: Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo
Titolo: Handbook of Wafer Bonding
Editore: Wiley-VCH; Wiley-VCH
396 Pagine
Anno di pubblicazione: 2012-01-11
Stampato / Fatto in
Peso: 0,924 kg
Lingua: Inglese
185,00 € (DE)
190,20 € (AT)
Available
170mm x 240mm x 26mm
BB; Hardcover, Softcover / Chemie/Sonstiges; Nanowissenschaften; Verstehen; Chemie; Components & Devices; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Halbleiterphysik; Komponenten u. Bauelemente; MEMS; Mikrosystemtechnik; Nanomaterial; Nanomaterialien; Nanomaterials; Nanostrukturiertes Material; Nanotechnologie; Nanotechnology; Physics; Physik; Semiconductor Physics; Wafer; MEMS; Komponenten u. Bauelemente; Nanomaterialien; Halbleiterphysik; Nanotechnologie
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.Altri libri che potrebbero essere simili a questo:
Ultimo libro simile:
9783527644230 Handbook of Wafer Bonding (Wiley-VCH)
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