Structural Analysis of Printed Circuit Board Systems by Peter A. Engel Hardcover | Indigo Chapters - nuovo libro

EAN (ISBN-13): 9780387979397
ISBN (ISBN-10): 0387979395
Copertina rigida
Copertina flessibile
Anno di pubblicazione: 1993
Editore: Peter A. Engel
316 Pagine
Peso: 0,637 kg
Lingua: eng/Englisch

Libro nella banca dati dal 2007-01-27T10:14:37+01:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-09-13T16:40:40+02:00 (Zurich)
ISBN/EAN: 9780387979397

ISBN - Stili di scrittura alternativi:
0-387-97939-5, 978-0-387-97939-7
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : peter engel, engels peter
Titolo del libro: circuit analysis, structural systems, around the circuit, system board

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Dati dell'editore

Autore: Peter A. Engel
Titolo: Mechanical Engineering Series; Structural Analysis of Printed Circuit Board Systems
Editore: Springer; Springer US
291 Pagine
Anno di pubblicazione: 1993-06-24
New York; NY; US
Lingua: Inglese
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
Available
XIX, 291 p.

BB; Hardcover, Softcover / Physik, Astronomie/Mechanik, Akustik; Klassische Mechanik; Verstehen; Sensor; deformation; elasticity; fatigue; interferometry; material; modeling; structural analysis; testing; transistor; Classical Mechanics; Characterization and Analytical Technique; Electronics and Microelectronics, Instrumentation; Werkstoffprüfung; Elektronik; BC

1. Elements of Structural Analysis.- 1. Rods.- 2. Beams.- 3. Plates.- 4. Thermal Stress.- 5. Plastic Beam Deformation.- 6. Energy Methods in Structural Analysis.- 7. Experimental Methods of Analysis.- References.- 2. Finite Element Analysis.- 1. Preliminaries.- 2. Direct Stiffness Matrix Approach.- 3. The Principle of Minimum Potential Energy.- 4. Element Types.- 5. Finite Element Dynamic Analysis.- 6. Stress and Strain Calculations.- 7. Structural Codes.- 8. Steps in the Use of Finite Element Analysis.- References.- 3. Components, Data, and Testing.- 1. Modules.- 2. Circuit Cards and Boards.- 3. Pin Leads of PGA Modules.- 4. Strength of Compliant Leads in Surface-Mount Construction.- 5. Stiffness of Compliant Leads.- 6. Solder Strength.- References.- 4. Leadless Chip Carriers.- 1. Loads and Materials.- 2. Thermal Stress Analysis.- 3. The Influence of Solder Joint Shape.- 4. Constitutive Equation for Solder Mount.- 5. Conclusions.- 6. Exercises and Questions.- References.- 5. Thermal Stress in Pin-Grid Arrays: Primary Analysis of Pins.- 1. Introduction.- 2. Elastic Foundation Modulus of a Soldered Pin.- 3. Elastic Foundation Treatment for the Embedded Pin.- 4. Solder Pressure Calculation.- 5. Plastic Analysis of the Pin.- 6. Axial Pin Force Due to Flexure.- 7. A Magnified-Scale Experiment.- 8. Conclusions.- 9. Exercises and Questions.- References.- 6. Thermal Stress in Pin-Grid Arrays: Interaction Between Module and Circuit Card.- 1. Pin Force Analysis Due to Module and Card Bending.- 2. Influence of Pin-End Moments.- 3. Influence of the Primary Axial Pin Forces.- 4. Influence of Secondary Axial Pin Forces.- 5. Solution of the System of Equations.- 6. Module and Card Stretch Due to Pin Shear.- 7. System Reduction Factor.- 8. Conclusions.- 9. Exercises and Questions.- References.- 7. Compliant Leaded Systems: The Local Assembly.- 1. Experimental Studies.- 2. Analytical Model.- 3. Properties of Simple Local Assemblies.- 4. Discrete Local Assembly.- 5. Built-up (Multiple-Module) Local Assemblies.- 6. Orthotropy of Local Assemblies.- 7. Module Group Assemblies.- 8. Conclusions.- 9. Exercises and Questions.- References.- 8. Bending in Compliant Leaded Systems.- 1. The Role of Leads.- 2. Application of the Finite Element Method.- 3. Strip Method.- 4. Building Block Method.- 5. Hybrid Experimental/Analytical Method.- 6. Conclusions.- 7. Exercises and Questions.- References.- 9. Approximate Engineering Theory for the Twisting of Compliant Leaded Circuit Card/Module Systems.- 1. Fundamental Approach.- 2. Torsional Stiffness Calculation.- 3. Rectangular Cards with a Module.- 4. Module Clusters.- 5. Finite Element Check of the Approximate Theory.- 6. Conclusions.- 7. Exercises and Questions.- References.- 10. Analytical Theory and Experimental Work in Compliant Leaded Systems Subjected to Twisting.- 1. Analytical Theory.- 2. Torsional Stiffness.- 3. Experimental Study.- 4. Large Displacements.- 5. Approximate Large Displacement Analysis of a Square Card.- 6. Torsional Fatigue.- 7. Conclusions.- 8. Exercises and Questions.- References.- 11. Thermal Stresses in Compliant Leaded Systems.- 1. Motivation for Analysis.- 2. Analytical Lead Stress Computation.- 3. Finite Element Thermal Stress Analysis.- 4. Stress Reduction in Compliant Leaded Solder Joints.- 5. Thermal Fatigue in Solder Joints of Compliant Leads.- 6. Thermal Cycling Reliability.- 7. Exercises and Questions.- References.- 12. Dynamic Response of Circuit Card Systems.- 1. General Considerations.- 2. Dynamic Load Levels and Measurement.- 3. Vibration Analysis in Circuit Card Systems.- 4.Transient Vibration and Shock Response.- 5. Fatigue Considerations.- 6. Conclusions.- 7. Exercises and Questions.- References.- 13. Plated Holes in Cards and Boards.- 1. Introduction.- 2. Thermal Stress from Module-to-Card Mismatch.- 3. Thermal Stress from Barrel-to-Board Mismatch.- 4. Experimental Methods.- 5. Vias.- 6. Conclusions.- 7. Exercises and Questions.- References.- 14. Assembly of Cards and Boards.- 1. Physical Description.- 2. ZIF Connector Actuation.- 3. Connector Contact.- 4. Dynamic Response.- 5. Thermal Stress.- 6. A Combined Permanent and Separable Connector System.- 7. Conclusions.- 8. Exercises and Questions.- References.- Author Index.