ISBN: 9780470065419
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in… Plus…
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2007, ISBN: 9780470065419
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ISBN: 9780470065419
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in… Plus…
2007, ISBN: 9780470065419
The topic of thin films is an area of increasing importance inmaterials science, electrical engineering and applied solid statephysics; with both research and industrial applications inmi… Plus…
2007
ISBN: 9780470065419
eBooks, eBook Download (PDF), 1. Auflage, [PU: John Wiley & Sons], John Wiley & Sons, 2007
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Informations détaillées sur le livre - Dielectric Films for Advanced Microelectronics
EAN (ISBN-13): 9780470065419
ISBN (ISBN-10): 0470065419
Date de parution: 2007
Editeur: Wiley
508 Pages
Langue: eng/Englisch
Livre dans la base de données depuis 2009-11-27T12:40:01+01:00 (Zurich)
Page de détail modifiée en dernier sur 2023-11-06T18:24:21+01:00 (Zurich)
ISBN/EAN: 0470065419
ISBN - Autres types d'écriture:
0-470-06541-9, 978-0-470-06541-9
Autres types d'écriture et termes associés:
Auteur du livre: martin green, marti green, green karen, john paul, martin mae, baklanov
Titre du livre: microelectronics
Données de l'éditeur
Auteur: Mikhail Baklanov
Titre: Wiley Series in Materials for Electronic & Optoelectronic Applications; Dielectric Films for Advanced Microelectronics
Editeur: Wiley; John Wiley & Sons
508 Pages
Date de parution: 2007-04-04
Langue: Anglais
208,99 € (DE)
EA; E107; E-Book; Nonbooks, PBS / Chemie; Technische Anwendung von Oberflächenbeschichtungen und -filmen; Dielectrics & Electric Insulators; Dielektrika u. Isolatoren; Dielektrizität; Dünne Schichten, Oberflächen u. Grenzflächen; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Materials Science; Materialwissenschaften; Mikroelektronik; Thin Films, Surfaces & Interfaces; Dielektrika u. Isolatoren; Dünne Schichten, Oberflächen u. Grenzflächen; BB
Series Preface. Preface. (Mikhail Baklanov, Martin Green and KarenMaex). 1. Low and Ultralow Dielectric Constant Films Preparedby Plasma-Enhanced Chemical Vapor Deposition. (A.Grill). 2. Spin-On Dielectric Materials. (GeraudDubois, Willi Volksen and Robert D. Miller). 3.Porosity of Low Dielectric Constant Materials. 3.1 Positron Annihilation Spectroscopy. (David W.Gidley, Hua-Gen Peng, and Richard Vallery). 3.2Structure Characterization of Nanoporous InterlevelDielectric Thin Films with X-ray and Neutron Radiation.(Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K.Lin, Wen-li Wu). 3.3 Ellipsometric Porosimetry. (M. R.Baklanov). 4.Mechanical and Transport Properties of Low-kDielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O.Rodriguez, R. Saxena, and W.N. Gill). 5. Integration of low-k dielectric films in damasceneprocesses. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M.Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F.Iacopi). 6. ONO structures and oxynitrides in modern microelectronics.Material science, characterization and application.(Yakov Roizin and Vladimir Gritsenko). High Dielectric constant Materials. 7. Material Engineering of High-k GateDielectrics. (Akira Toriumi and Koji Kita). 8. PhysicalCharacterisation of ultra-thin high-k dielectric. (T.Conard, H. Bender and W. Vandervorst). 9. Electrical Characterization of Advanced GateDielectrics. (Robin Degraeve, Jurriaan Schmitz,Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, andGuido Groeseneken). Medium dielectric constant materials. 10. Integration Issues of High-k Gate Dielectrics.(Yasuo Nara). Dielectric films for interconnects (packaging). 11. Anisotropic Conductive Film (ACF) for AdvancedMicroelectronic Interconnects. (Yi Li, C. P.Wong). Index.Autres livres qui pourraient ressembler au livre recherché:
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9780470017944 Dielectric Films for Advanced Microelectronics (Mikhail Baklanov, Karen Maex, Martin Green)
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