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MEMS and Nanotechnology, Volume 4 - Tom Proulx
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MEMS and Nanotechnology, Volume 4 - nouveau livre

2011, ISBN: 9781461402107

Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics, eBooks, eBook Download (PDF), MEMS and Nanotechnology, Volume 4 represents one of eight volumes of technic… Plus…

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MEMS and Nanotechnology Volume 4
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MEMS and Nanotechnology Volume 4 - nouveau livre

2011

ISBN: 9781461402107

*MEMS and Nanotechnology Volume 4* - Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics / pdf eBook für 213.99 € / Aus dem Bereich: eBooks, Sachthemen & Ratge… Plus…

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MEMS and Nanotechnology, Volume 4 : Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics - Richard E. Maurer
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MEMS and Nanotechnology, Volume 4 : Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics - nouveau livre

2011, ISBN: 9781461402107

; EPUB; Scientific, Technical and Medical > Technology: general issues > Nanotechnology, R&L Education

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MEMS and Nanotechnology, Volume 4 - Tom Proulx
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Tom Proulx:
MEMS and Nanotechnology, Volume 4 - nouveau livre

2011, ISBN: 9781461402107

Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics, eBooks, eBook Download (PDF), [PU: Springer New York], Springer New York, 2011

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Informations détaillées sur le livre - MEMS and Nanotechnology Volume 4


EAN (ISBN-13): 9781461402107
Date de parution: 2011
Editeur: Springer-Verlag GmbH

Livre dans la base de données depuis 2008-04-27T07:10:43+02:00 (Zurich)
Page de détail modifiée en dernier sur 2024-01-08T15:23:19+01:00 (Zurich)
ISBN/EAN: 9781461402107

ISBN - Autres types d'écriture:
978-1-4614-0210-7
Autres types d'écriture et termes associés:
Auteur du livre: proulx, 978 06709211607
Titre du livre: proceedings applied mechanics


Données de l'éditeur

Auteur: Tom Proulx
Titre: Conference Proceedings of the Society for Experimental Mechanics Series; MEMS and Nanotechnology, Volume 4 - Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics
Editeur: Springer; Springer US
192 Pages
Date de parution: 2011-05-21
New York; NY; US
Imprimé / Fabriqué en
Langue: Anglais
213,99 € (DE)
220,00 € (AT)
236,00 CHF (CH)
Available
VIII, 192 p.

EA; E107; eBook; Nonbooks, PBS / Technik/Sonstiges; Elektronik; Verstehen; C; Nanotechnology and Microengineering; Mechatronics; Nanotechnology; Microsystems and MEMS; Mechatronics; Nanotechnology; Engineering; Maschinenbau; Nanotechnologie; BB

Integrated Process Feasibility of Hard-mask for Tight Pitch Interconnects Fabrication.- Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures.- Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon.- Nano-tubes Reinforced Epoxy.- A Nano-tensile Tester for Creep Studies.- The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing.- New Insight Into Pile-Up in Thin Film Indentation.- Measuring Substrate-independent Young’s Modulus of Thin Films.- Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach.- Nano-indentation Studies of Polyglactin 910 Monofilament Sutures.- Analytical Approach for the Determination of Nanomechanical Properties for Metals.- Advances in Thin Film Indentation.- Cyclic Nanoindentation Shakedown of Muscovite and its Elastic Modulus Measurement.- Assessment of Digital Holography for 3D-shape Measurement of Micro Deep Drawing Parts in Comparison to Confocal Microscopy.- Full-field Bulge Testing Using Global Digital Image Correlation.- Experimental Investigation of Deformation Mechanisms Present in Ultrafine-grained Metals.- Characterization of  a Variation on AFIT's Tunable MEMS Cantilever Array Metamaterial.- MEMS for Real-time Infrared Imaging.- New Insights Into Enhancing Microcantilever MEMS Sensors.- A Miniature MRI-compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer.- Micromechanical Structure With Stable Linear Positive and Negative Stiffness.- Terahertz Metamaterial Structures Fabricated by PolyMUMPs.- Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths.- MEMS Integrated Metamaterials With Variable Resonance Operating at RF Frequencies.- Creep Measurements in Free-standing Thin Metal Film Micro-cantilever Bending.- MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Analysis.- Analysis and Evaluation Methods Associated With the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies.- Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-based Luminaire.- Direct Determination of Interfacial Traction-separation Relations in Chip-package Systems

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