2016, ISBN: 366249681X

[EAN: 9783662496817], Neubuch, [SC: 0.0], [PU: Springer Berlin Heidelberg], CHEMIE; FESTKÖRPERPHYSIK; ELEKTRONIK / HALBLEITER; LEITUNG (PHYSIKALISCH) MASSENSPEKTROMETRIE - SPEKTROMETRIE; … Plus…

[EAN: 9783662496817], Neubuch, [SC: 0.0], [PU: Springer Berlin Heidelberg], CHEMIE; FESTKÖRPERPHYSIK; ELEKTRONIK / HALBLEITER; LEITUNG (PHYSIKALISCH) MASSENSPEKTROMETRIE - SPEKTROMETRIE; NANOTECHNOLOGIE; TECHNOLOGIE SPEKTROSKOPIE; CONTACTRESISTANCE; THERMALSTABILITY; GERMANIUM-BASEDMOSFET; DOPANTSEGREGATION; SOURCEANDDRAIN; NICKELGERMANIDE; DOPANTACTIVATION; MOSDEVICE, Druck auf Anfrage Neuware - Printed after ordering - This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600 and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10-7 -cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node., Books<

2022, ISBN: 9783662496817

[ED: Buch], [PU: Springer Berlin Heidelberg], Neuware - This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With  adopting of the … Plus…

[ED: Buch], [PU: Springer Berlin Heidelberg], Neuware - This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With  adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600 and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10-7 -cm2, respectively. Besides, a reduced  source/drain parasitic resistance is demonstrated in the  fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.- Besorgungstitel - vorauss. Lieferzeit 3-5 Tage., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 241x160x10 mm, 80, [GW: 310g], Banküberweisung, Offene Rechnung, Kreditkarte, PayPal, Offene Rechnung (Vorkasse vorbehalten), Internationaler Versand<

2016, ISBN: 9783662496817

[ED: Hardcover], [PU: Springer / Springer Berlin Heidelberg / Springer, Berlin], This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFE… Plus…

[ED: Hardcover], [PU: Springer / Springer Berlin Heidelberg / Springer, Berlin], This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600 and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10-7 -cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node. 1st ed. 2016. 2016. xiv, 59 S. XIV, 59 p. 52 illus., 49 illus. in color. 235 mm Versandfertig in 6-10 Tagen, DE, [SC: 0.00], Neuware, gewerbliches Angebot, Offene Rechnung (Vorkasse vorbehalten)<

ISBN: 9783662496817

This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co… Plus…

This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600℃ and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10−7Ω•cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node. Trade Books>Hardcover>Science>Engineering>ELEC Engr, Springer Berlin Heidelberg Core >2<

2016, ISBN: 366249681X

[EAN: 9783662496817], Neubuch, [SC: 0.0], [PU: Springer Berlin Heidelberg], CHEMIE FESTKÖRPERPHYSIK ELEKTRONIK HALBLEITER LEITUNG (PHYSIKALISCH) MASSENSPEKTROMETRIE - SPEKTROMETRIE NANOTE… Plus…

[EAN: 9783662496817], Neubuch, [SC: 0.0], [PU: Springer Berlin Heidelberg], CHEMIE FESTKÖRPERPHYSIK ELEKTRONIK HALBLEITER LEITUNG (PHYSIKALISCH) MASSENSPEKTROMETRIE - SPEKTROMETRIE NANOTECHNOLOGIE TECHNOLOGIE SPEKTROSKOPIE CONTACTRESISTANCE THERMALSTABILITY GERMANIUM-BASEDMOSFET DOPANTSE TECHNIK ELEKTROTECHNIK NACHRICHTENTECHNIK, Books<